燙(tang)金基本工藝是在壓(ya)力(li)狀態，即電(dian)化(hua)(hua)鋁(lv)(lv)(lv)被燙(tang)印(yin)版、承印(yin)物(wu)(wu)壓(ya)住的(de)(de)(de)狀態下，電(dian)化(hua)(hua)鋁(lv)(lv)(lv)受熱(re)使(shi)其上(shang)熱(re)熔(rong)(rong)性(xing)的(de)(de)(de)有機硅(gui)樹脂(zhi)層和膠(jiao)牯劑(ji)熔(rong)(rong)化(hua)(hua)，此時受熱(re)熔(rong)(rong)化(hua)(hua)的(de)(de)(de)有機硅(gui)樹脂(zhi)粘性(xing)變小，而特種熱(re)敏(min)膠(jiao)粘劑(ji)受熱(re)熔(rong)(rong)化(hua)(hua)后粘性(xing)增加，使(shi)得(de)鋁(lv)(lv)(lv)層與電(dian)化(hua)(hua)鋁(lv)(lv)(lv)基膜(mo)剝離的(de)(de)(de)同時轉印(yin)到了承印(yin)物(wu)(wu)上(shang)。隨著壓(ya)力(li)的(de)(de)(de)卸除，膠(jiao)粘劑(ji)迅速冷(leng)卻固(gu)化(hua)(hua)，鋁(lv)(lv)(lv)層牢固(gu)地附著在承印(yin)物(wu)(wu)上(shang)，完成一(yi)個燙(tang)印(yin)過程。