燙金基(ji)本工(gong)藝是在(zai)(zai)壓(ya)力狀態，即電化(hua)(hua)(hua)鋁(lv)(lv)(lv)被燙印版、承印物壓(ya)住的狀態下，電化(hua)(hua)(hua)鋁(lv)(lv)(lv)受熱使(shi)其上熱熔(rong)(rong)性(xing)的有機(ji)(ji)硅樹脂(zhi)層(ceng)(ceng)和(he)膠牯劑熔(rong)(rong)化(hua)(hua)(hua)，此時受熱熔(rong)(rong)化(hua)(hua)(hua)的有機(ji)(ji)硅樹脂(zhi)粘性(xing)變小，而特種熱敏膠粘劑受熱熔(rong)(rong)化(hua)(hua)(hua)后粘性(xing)增加，使(shi)得(de)鋁(lv)(lv)(lv)層(ceng)(ceng)與電化(hua)(hua)(hua)鋁(lv)(lv)(lv)基(ji)膜(mo)剝(bo)離的同(tong)時轉(zhuan)印到(dao)了承印物上。隨著壓(ya)力的卸除(chu)，膠粘劑迅速冷卻固化(hua)(hua)(hua)，鋁(lv)(lv)(lv)層(ceng)(ceng)牢固地(di)附(fu)著在(zai)(zai)承印物上，完成一個燙印過程。