燙金基本(ben)工藝是在壓(ya)力狀態(tai)，即電化(hua)(hua)(hua)(hua)鋁(lv)被(bei)燙印版、承(cheng)印物(wu)壓(ya)住的(de)(de)(de)狀態(tai)下，電化(hua)(hua)(hua)(hua)鋁(lv)受熱(re)(re)使其(qi)上(shang)熱(re)(re)熔(rong)(rong)(rong)性(xing)(xing)的(de)(de)(de)有機硅樹脂(zhi)(zhi)層和膠牯劑熔(rong)(rong)(rong)化(hua)(hua)(hua)(hua)，此(ci)時(shi)受熱(re)(re)熔(rong)(rong)(rong)化(hua)(hua)(hua)(hua)的(de)(de)(de)有機硅樹脂(zhi)(zhi)粘(zhan)性(xing)(xing)變小，而特種熱(re)(re)敏(min)膠粘(zhan)劑受熱(re)(re)熔(rong)(rong)(rong)化(hua)(hua)(hua)(hua)后粘(zhan)性(xing)(xing)增加，使得(de)鋁(lv)層與電化(hua)(hua)(hua)(hua)鋁(lv)基膜剝離的(de)(de)(de)同時(shi)轉印到了承(cheng)印物(wu)上(shang)。隨著(zhu)壓(ya)力的(de)(de)(de)卸除，膠粘(zhan)劑迅速冷卻固化(hua)(hua)(hua)(hua)，鋁(lv)層牢固地附著(zhu)在承(cheng)印物(wu)上(shang)，完(wan)成一個燙印過(guo)程。