燙金(jin)基(ji)本工(gong)藝(yi)是在壓(ya)(ya)力狀態，即電化(hua)鋁(lv)被(bei)燙印(yin)版(ban)、承(cheng)印(yin)物壓(ya)(ya)住的(de)狀態下(xia)，電化(hua)鋁(lv)受熱(re)(re)(re)使其上(shang)熱(re)(re)(re)熔(rong)(rong)(rong)性(xing)(xing)的(de)有機硅(gui)樹(shu)脂(zhi)層(ceng)和膠(jiao)(jiao)牯劑熔(rong)(rong)(rong)化(hua)，此時(shi)(shi)受熱(re)(re)(re)熔(rong)(rong)(rong)化(hua)的(de)有機硅(gui)樹(shu)脂(zhi)粘性(xing)(xing)變小，而特種熱(re)(re)(re)敏膠(jiao)(jiao)粘劑受熱(re)(re)(re)熔(rong)(rong)(rong)化(hua)后粘性(xing)(xing)增加，使得鋁(lv)層(ceng)與電化(hua)鋁(lv)基(ji)膜剝離的(de)同時(shi)(shi)轉印(yin)到了承(cheng)印(yin)物上(shang)。隨(sui)著壓(ya)(ya)力的(de)卸除，膠(jiao)(jiao)粘劑迅速(su)冷卻固(gu)化(hua)，鋁(lv)層(ceng)牢固(gu)地附著在承(cheng)印(yin)物上(shang)，完成一(yi)個燙印(yin)過(guo)程(cheng)。