燙(tang)金基本工藝是在(zai)壓力狀(zhuang)態(tai)，即(ji)電(dian)化(hua)(hua)鋁(lv)(lv)被燙(tang)印版、承印物(wu)壓住的(de)狀(zhuang)態(tai)下，電(dian)化(hua)(hua)鋁(lv)(lv)受(shou)熱使(shi)其上(shang)熱熔(rong)性(xing)的(de)有機(ji)(ji)硅(gui)樹脂(zhi)層和膠(jiao)牯劑(ji)熔(rong)化(hua)(hua)，此時受(shou)熱熔(rong)化(hua)(hua)的(de)有機(ji)(ji)硅(gui)樹脂(zhi)粘(zhan)(zhan)(zhan)性(xing)變小(xiao)，而特(te)種(zhong)熱敏(min)膠(jiao)粘(zhan)(zhan)(zhan)劑(ji)受(shou)熱熔(rong)化(hua)(hua)后粘(zhan)(zhan)(zhan)性(xing)增加，使(shi)得鋁(lv)(lv)層與(yu)電(dian)化(hua)(hua)鋁(lv)(lv)基膜剝離(li)的(de)同時轉印到了承印物(wu)上(shang)。隨著壓力的(de)卸(xie)除，膠(jiao)粘(zhan)(zhan)(zhan)劑(ji)迅速冷(leng)卻固(gu)化(hua)(hua)，鋁(lv)(lv)層牢固(gu)地附著在(zai)承印物(wu)上(shang)，完成(cheng)一個(ge)燙(tang)印過程。