燙(tang)金基本工藝是在壓(ya)力狀態(tai)，即電(dian)化(hua)(hua)鋁(lv)(lv)被燙(tang)印(yin)版、承印(yin)物壓(ya)住的(de)(de)(de)狀態(tai)下，電(dian)化(hua)(hua)鋁(lv)(lv)受熱(re)使其上(shang)(shang)熱(re)熔(rong)(rong)性(xing)的(de)(de)(de)有機(ji)硅樹脂(zhi)層(ceng)和膠(jiao)牯劑熔(rong)(rong)化(hua)(hua)，此時(shi)受熱(re)熔(rong)(rong)化(hua)(hua)的(de)(de)(de)有機(ji)硅樹脂(zhi)粘(zhan)(zhan)性(xing)變小(xiao)，而(er)特種熱(re)敏膠(jiao)粘(zhan)(zhan)劑受熱(re)熔(rong)(rong)化(hua)(hua)后(hou)粘(zhan)(zhan)性(xing)增加，使得鋁(lv)(lv)層(ceng)與(yu)電(dian)化(hua)(hua)鋁(lv)(lv)基膜(mo)剝(bo)離的(de)(de)(de)同時(shi)轉印(yin)到了承印(yin)物上(shang)(shang)。隨著壓(ya)力的(de)(de)(de)卸除，膠(jiao)粘(zhan)(zhan)劑迅(xun)速(su)冷卻固(gu)化(hua)(hua)，鋁(lv)(lv)層(ceng)牢固(gu)地附(fu)著在承印(yin)物上(shang)(shang)，完(wan)成一個燙(tang)印(yin)過(guo)程(cheng)。