燙(tang)金基(ji)本工藝是在(zai)壓(ya)力狀(zhuang)態，即電(dian)化(hua)鋁被燙(tang)印(yin)(yin)(yin)(yin)版(ban)、承(cheng)印(yin)(yin)(yin)(yin)物(wu)壓(ya)住的(de)狀(zhuang)態下，電(dian)化(hua)鋁受(shou)(shou)熱(re)使(shi)其上(shang)熱(re)熔(rong)性(xing)的(de)有機硅樹(shu)脂層(ceng)(ceng)和膠(jiao)(jiao)牯劑熔(rong)化(hua)，此時(shi)受(shou)(shou)熱(re)熔(rong)化(hua)的(de)有機硅樹(shu)脂粘(zhan)性(xing)變小，而特種熱(re)敏膠(jiao)(jiao)粘(zhan)劑受(shou)(shou)熱(re)熔(rong)化(hua)后(hou)粘(zhan)性(xing)增加，使(shi)得鋁層(ceng)(ceng)與電(dian)化(hua)鋁基(ji)膜剝離的(de)同時(shi)轉印(yin)(yin)(yin)(yin)到了承(cheng)印(yin)(yin)(yin)(yin)物(wu)上(shang)。隨著壓(ya)力的(de)卸(xie)除，膠(jiao)(jiao)粘(zhan)劑迅速(su)冷(leng)卻固(gu)化(hua)，鋁層(ceng)(ceng)牢固(gu)地(di)附著在(zai)承(cheng)印(yin)(yin)(yin)(yin)物(wu)上(shang)，完成一個燙(tang)印(yin)(yin)(yin)(yin)過程。