燙金(jin)基(ji)本工藝是在(zai)壓力狀態，即電化(hua)(hua)鋁(lv)被燙印(yin)(yin)版、承(cheng)(cheng)印(yin)(yin)物壓住(zhu)的狀態下，電化(hua)(hua)鋁(lv)受熱使(shi)其上(shang)(shang)熱熔(rong)(rong)性(xing)的有(you)機硅樹脂層和膠牯劑(ji)熔(rong)(rong)化(hua)(hua)，此時(shi)受熱熔(rong)(rong)化(hua)(hua)的有(you)機硅樹脂粘(zhan)性(xing)變(bian)小，而特種熱敏膠粘(zhan)劑(ji)受熱熔(rong)(rong)化(hua)(hua)后粘(zhan)性(xing)增加，使(shi)得鋁(lv)層與電化(hua)(hua)鋁(lv)基(ji)膜剝離的同時(shi)轉印(yin)(yin)到了(le)承(cheng)(cheng)印(yin)(yin)物上(shang)(shang)。隨著壓力的卸除，膠粘(zhan)劑(ji)迅速冷卻固化(hua)(hua)，鋁(lv)層牢固地附著在(zai)承(cheng)(cheng)印(yin)(yin)物上(shang)(shang)，完(wan)成一個(ge)燙印(yin)(yin)過程。