燙金(jin)基(ji)本工(gong)藝(yi)是在(zai)壓力狀(zhuang)態(tai)，即電(dian)化(hua)(hua)鋁(lv)(lv)被燙印(yin)版、承(cheng)印(yin)物壓住的狀(zhuang)態(tai)下(xia)，電(dian)化(hua)(hua)鋁(lv)(lv)受(shou)熱使其上(shang)熱熔(rong)性(xing)的有機硅樹脂(zhi)層(ceng)和膠牯劑熔(rong)化(hua)(hua)，此時受(shou)熱熔(rong)化(hua)(hua)的有機硅樹脂(zhi)粘(zhan)性(xing)變小，而特種熱敏膠粘(zhan)劑受(shou)熱熔(rong)化(hua)(hua)后粘(zhan)性(xing)增加，使得鋁(lv)(lv)層(ceng)與電(dian)化(hua)(hua)鋁(lv)(lv)基(ji)膜剝離(li)的同時轉印(yin)到了承(cheng)印(yin)物上(shang)。隨著壓力的卸除，膠粘(zhan)劑迅速冷卻固(gu)化(hua)(hua)，鋁(lv)(lv)層(ceng)牢固(gu)地(di)附著在(zai)承(cheng)印(yin)物上(shang)，完成一個(ge)燙印(yin)過程。