燙(tang)金基(ji)本工藝(yi)是在壓(ya)(ya)力狀態，即電(dian)化(hua)鋁被燙(tang)印(yin)(yin)版、承(cheng)印(yin)(yin)物(wu)壓(ya)(ya)住的狀態下，電(dian)化(hua)鋁受(shou)(shou)(shou)熱(re)使其上熱(re)熔(rong)性的有(you)機(ji)硅(gui)樹脂(zhi)層(ceng)和膠牯劑熔(rong)化(hua)，此時(shi)受(shou)(shou)(shou)熱(re)熔(rong)化(hua)的有(you)機(ji)硅(gui)樹脂(zhi)粘性變小(xiao)，而特種熱(re)敏膠粘劑受(shou)(shou)(shou)熱(re)熔(rong)化(hua)后粘性增加，使得鋁層(ceng)與電(dian)化(hua)鋁基(ji)膜(mo)剝離的同時(shi)轉印(yin)(yin)到了承(cheng)印(yin)(yin)物(wu)上。隨著(zhu)(zhu)壓(ya)(ya)力的卸除，膠粘劑迅速冷卻固化(hua)，鋁層(ceng)牢固地附著(zhu)(zhu)在承(cheng)印(yin)(yin)物(wu)上，完成一個(ge)燙(tang)印(yin)(yin)過程。