燙金基(ji)本(ben)工藝是(shi)在(zai)壓(ya)力狀態(tai)，即電(dian)(dian)化(hua)鋁(lv)被燙印(yin)(yin)版(ban)、承印(yin)(yin)物(wu)(wu)壓(ya)住的(de)狀態(tai)下，電(dian)(dian)化(hua)鋁(lv)受(shou)(shou)熱(re)使(shi)其(qi)上(shang)熱(re)熔(rong)性(xing)的(de)有(you)機(ji)硅(gui)樹(shu)(shu)脂(zhi)層(ceng)和膠(jiao)(jiao)牯(gu)劑(ji)熔(rong)化(hua)，此時受(shou)(shou)熱(re)熔(rong)化(hua)的(de)有(you)機(ji)硅(gui)樹(shu)(shu)脂(zhi)粘(zhan)性(xing)變小(xiao)，而特種(zhong)熱(re)敏(min)膠(jiao)(jiao)粘(zhan)劑(ji)受(shou)(shou)熱(re)熔(rong)化(hua)后粘(zhan)性(xing)增加，使(shi)得鋁(lv)層(ceng)與(yu)電(dian)(dian)化(hua)鋁(lv)基(ji)膜(mo)剝離(li)的(de)同時轉(zhuan)印(yin)(yin)到(dao)了承印(yin)(yin)物(wu)(wu)上(shang)。隨著(zhu)壓(ya)力的(de)卸除，膠(jiao)(jiao)粘(zhan)劑(ji)迅(xun)速冷(leng)卻固(gu)化(hua)，鋁(lv)層(ceng)牢固(gu)地(di)附著(zhu)在(zai)承印(yin)(yin)物(wu)(wu)上(shang)，完成一(yi)個燙印(yin)(yin)過程(cheng)。