燙(tang)金(jin)基本(ben)工藝是在壓力(li)狀態，即電(dian)(dian)化鋁(lv)被燙(tang)印(yin)版、承(cheng)印(yin)物壓住的(de)(de)狀態下(xia)，電(dian)(dian)化鋁(lv)受(shou)熱(re)(re)使其上熱(re)(re)熔(rong)性(xing)的(de)(de)有機(ji)硅樹脂層和膠(jiao)牯劑(ji)熔(rong)化，此時(shi)受(shou)熱(re)(re)熔(rong)化的(de)(de)有機(ji)硅樹脂粘(zhan)(zhan)性(xing)變小(xiao)，而特(te)種(zhong)熱(re)(re)敏膠(jiao)粘(zhan)(zhan)劑(ji)受(shou)熱(re)(re)熔(rong)化后粘(zhan)(zhan)性(xing)增(zeng)加，使得鋁(lv)層與電(dian)(dian)化鋁(lv)基膜剝離的(de)(de)同時(shi)轉(zhuan)印(yin)到了(le)承(cheng)印(yin)物上。隨著壓力(li)的(de)(de)卸除，膠(jiao)粘(zhan)(zhan)劑(ji)迅速冷卻固化，鋁(lv)層牢固地附著在承(cheng)印(yin)物上，完成一(yi)個(ge)燙(tang)印(yin)過程。