燙(tang)金基本工藝是(shi)在(zai)壓(ya)(ya)力狀態(tai)，即電(dian)(dian)化(hua)(hua)鋁(lv)被燙(tang)印(yin)版、承(cheng)印(yin)物壓(ya)(ya)住的狀態(tai)下，電(dian)(dian)化(hua)(hua)鋁(lv)受(shou)熱使其上熱熔(rong)性(xing)的有機硅樹(shu)脂層(ceng)和膠(jiao)牯劑熔(rong)化(hua)(hua)，此時受(shou)熱熔(rong)化(hua)(hua)的有機硅樹(shu)脂粘(zhan)性(xing)變(bian)小，而(er)特種熱敏膠(jiao)粘(zhan)劑受(shou)熱熔(rong)化(hua)(hua)后粘(zhan)性(xing)增加(jia)，使得鋁(lv)層(ceng)與電(dian)(dian)化(hua)(hua)鋁(lv)基膜剝離(li)的同時轉印(yin)到了(le)承(cheng)印(yin)物上。隨著壓(ya)(ya)力的卸(xie)除，膠(jiao)粘(zhan)劑迅速冷卻固化(hua)(hua)，鋁(lv)層(ceng)牢固地附著在(zai)承(cheng)印(yin)物上，完成一個(ge)燙(tang)印(yin)過程。