燙金基(ji)本工藝是在壓力(li)(li)狀(zhuang)態，即電(dian)(dian)化(hua)(hua)(hua)鋁(lv)被(bei)燙印(yin)版、承(cheng)印(yin)物壓住(zhu)的(de)狀(zhuang)態下，電(dian)(dian)化(hua)(hua)(hua)鋁(lv)受(shou)熱(re)使其上(shang)熱(re)熔(rong)(rong)性的(de)有(you)機硅樹脂層(ceng)和膠牯劑熔(rong)(rong)化(hua)(hua)(hua)，此時受(shou)熱(re)熔(rong)(rong)化(hua)(hua)(hua)的(de)有(you)機硅樹脂粘性變(bian)小(xiao)，而特種熱(re)敏(min)膠粘劑受(shou)熱(re)熔(rong)(rong)化(hua)(hua)(hua)后粘性增加，使得鋁(lv)層(ceng)與電(dian)(dian)化(hua)(hua)(hua)鋁(lv)基(ji)膜剝離的(de)同時轉印(yin)到了承(cheng)印(yin)物上(shang)。隨著(zhu)(zhu)壓力(li)(li)的(de)卸除，膠粘劑迅速冷卻固化(hua)(hua)(hua)，鋁(lv)層(ceng)牢(lao)固地(di)附著(zhu)(zhu)在承(cheng)印(yin)物上(shang)，完(wan)成一(yi)個(ge)燙印(yin)過程。