燙(tang)金基本工藝是(shi)在壓力(li)狀(zhuang)態(tai)，即電化(hua)(hua)鋁(lv)被燙(tang)印(yin)版、承(cheng)印(yin)物壓住的(de)(de)狀(zhuang)態(tai)下，電化(hua)(hua)鋁(lv)受(shou)(shou)熱(re)使其上熱(re)熔(rong)(rong)性(xing)的(de)(de)有(you)(you)機(ji)硅(gui)樹(shu)脂層(ceng)和膠牯劑熔(rong)(rong)化(hua)(hua)，此時受(shou)(shou)熱(re)熔(rong)(rong)化(hua)(hua)的(de)(de)有(you)(you)機(ji)硅(gui)樹(shu)脂粘(zhan)(zhan)性(xing)變小(xiao)，而特種熱(re)敏膠粘(zhan)(zhan)劑受(shou)(shou)熱(re)熔(rong)(rong)化(hua)(hua)后粘(zhan)(zhan)性(xing)增加，使得(de)鋁(lv)層(ceng)與電化(hua)(hua)鋁(lv)基膜剝離的(de)(de)同(tong)時轉(zhuan)印(yin)到了承(cheng)印(yin)物上。隨著壓力(li)的(de)(de)卸除，膠粘(zhan)(zhan)劑迅(xun)速冷(leng)卻固化(hua)(hua)，鋁(lv)層(ceng)牢固地附著在承(cheng)印(yin)物上，完成一(yi)個燙(tang)印(yin)過程。