燙(tang)金基本工藝是在壓力(li)狀態，即電化(hua)鋁(lv)(lv)被燙(tang)印版、承(cheng)(cheng)印物壓住的(de)狀態下，電化(hua)鋁(lv)(lv)受(shou)(shou)熱使(shi)其上(shang)熱熔(rong)(rong)(rong)性的(de)有(you)機硅樹(shu)脂(zhi)層和膠牯劑(ji)(ji)熔(rong)(rong)(rong)化(hua)，此時(shi)(shi)受(shou)(shou)熱熔(rong)(rong)(rong)化(hua)的(de)有(you)機硅樹(shu)脂(zhi)粘(zhan)性變(bian)小，而特種熱敏膠粘(zhan)劑(ji)(ji)受(shou)(shou)熱熔(rong)(rong)(rong)化(hua)后粘(zhan)性增加，使(shi)得鋁(lv)(lv)層與(yu)電化(hua)鋁(lv)(lv)基膜剝離(li)的(de)同時(shi)(shi)轉印到了承(cheng)(cheng)印物上(shang)。隨(sui)著壓力(li)的(de)卸除，膠粘(zhan)劑(ji)(ji)迅速(su)冷卻固化(hua)，鋁(lv)(lv)層牢固地附(fu)著在承(cheng)(cheng)印物上(shang)，完成(cheng)一(yi)個燙(tang)印過程。