燙金基本工藝是在壓力狀(zhuang)態，即(ji)電化(hua)鋁(lv)(lv)被燙印(yin)(yin)(yin)版、承印(yin)(yin)(yin)物壓住(zhu)的狀(zhuang)態下，電化(hua)鋁(lv)(lv)受(shou)(shou)熱(re)使(shi)其上(shang)熱(re)熔(rong)(rong)(rong)性(xing)的有機硅(gui)樹脂層(ceng)和(he)膠牯劑(ji)(ji)熔(rong)(rong)(rong)化(hua)，此(ci)時受(shou)(shou)熱(re)熔(rong)(rong)(rong)化(hua)的有機硅(gui)樹脂粘(zhan)(zhan)性(xing)變(bian)小，而特(te)種熱(re)敏膠粘(zhan)(zhan)劑(ji)(ji)受(shou)(shou)熱(re)熔(rong)(rong)(rong)化(hua)后(hou)粘(zhan)(zhan)性(xing)增加，使(shi)得鋁(lv)(lv)層(ceng)與(yu)電化(hua)鋁(lv)(lv)基膜(mo)剝離的同時轉印(yin)(yin)(yin)到了承印(yin)(yin)(yin)物上(shang)。隨著壓力的卸除，膠粘(zhan)(zhan)劑(ji)(ji)迅速冷卻固(gu)化(hua)，鋁(lv)(lv)層(ceng)牢固(gu)地附著在承印(yin)(yin)(yin)物上(shang)，完成一個燙印(yin)(yin)(yin)過程。