燙(tang)金基本工藝是(shi)在壓(ya)(ya)力(li)(li)狀(zhuang)態，即電(dian)化(hua)(hua)鋁(lv)被燙(tang)印(yin)(yin)版、承(cheng)印(yin)(yin)物(wu)壓(ya)(ya)住的狀(zhuang)態下，電(dian)化(hua)(hua)鋁(lv)受熱(re)(re)使(shi)其上(shang)熱(re)(re)熔(rong)性的有機(ji)硅樹脂(zhi)層和膠牯劑熔(rong)化(hua)(hua)，此時(shi)受熱(re)(re)熔(rong)化(hua)(hua)的有機(ji)硅樹脂(zhi)粘性變小，而(er)特(te)種(zhong)熱(re)(re)敏膠粘劑受熱(re)(re)熔(rong)化(hua)(hua)后(hou)粘性增(zeng)加，使(shi)得鋁(lv)層與(yu)電(dian)化(hua)(hua)鋁(lv)基膜(mo)剝(bo)離的同時(shi)轉印(yin)(yin)到了承(cheng)印(yin)(yin)物(wu)上(shang)。隨著(zhu)壓(ya)(ya)力(li)(li)的卸除，膠粘劑迅(xun)速冷卻固(gu)化(hua)(hua)，鋁(lv)層牢(lao)固(gu)地(di)附著(zhu)在承(cheng)印(yin)(yin)物(wu)上(shang)，完(wan)成一個燙(tang)印(yin)(yin)過程。