燙(tang)金基(ji)本工藝是在(zai)壓(ya)(ya)力狀態(tai)，即電(dian)化(hua)(hua)鋁(lv)被(bei)燙(tang)印(yin)(yin)(yin)版(ban)、承(cheng)印(yin)(yin)(yin)物壓(ya)(ya)住的(de)(de)狀態(tai)下，電(dian)化(hua)(hua)鋁(lv)受(shou)(shou)熱(re)使其上熱(re)熔(rong)(rong)(rong)性(xing)的(de)(de)有機(ji)硅樹脂(zhi)(zhi)層(ceng)和(he)膠(jiao)牯劑(ji)熔(rong)(rong)(rong)化(hua)(hua)，此(ci)時(shi)受(shou)(shou)熱(re)熔(rong)(rong)(rong)化(hua)(hua)的(de)(de)有機(ji)硅樹脂(zhi)(zhi)粘性(xing)變小，而(er)特種(zhong)熱(re)敏(min)膠(jiao)粘劑(ji)受(shou)(shou)熱(re)熔(rong)(rong)(rong)化(hua)(hua)后粘性(xing)增加，使得鋁(lv)層(ceng)與(yu)電(dian)化(hua)(hua)鋁(lv)基(ji)膜剝離的(de)(de)同時(shi)轉印(yin)(yin)(yin)到(dao)了承(cheng)印(yin)(yin)(yin)物上。隨著壓(ya)(ya)力的(de)(de)卸除，膠(jiao)粘劑(ji)迅速冷(leng)卻固化(hua)(hua)，鋁(lv)層(ceng)牢固地附著在(zai)承(cheng)印(yin)(yin)(yin)物上，完成一個燙(tang)印(yin)(yin)(yin)過程。