燙金基(ji)(ji)本工藝(yi)是在壓力(li)狀態，即(ji)電(dian)化(hua)(hua)鋁(lv)被燙印(yin)版(ban)、承(cheng)印(yin)物壓住的狀態下，電(dian)化(hua)(hua)鋁(lv)受熱(re)使其上熱(re)熔性(xing)的有(you)機硅(gui)樹(shu)脂(zhi)(zhi)層和膠(jiao)牯(gu)劑(ji)熔化(hua)(hua)，此時受熱(re)熔化(hua)(hua)的有(you)機硅(gui)樹(shu)脂(zhi)(zhi)粘(zhan)(zhan)(zhan)性(xing)變小，而特種熱(re)敏膠(jiao)粘(zhan)(zhan)(zhan)劑(ji)受熱(re)熔化(hua)(hua)后粘(zhan)(zhan)(zhan)性(xing)增(zeng)加(jia)，使得鋁(lv)層與電(dian)化(hua)(hua)鋁(lv)基(ji)(ji)膜剝離的同(tong)時轉(zhuan)印(yin)到了承(cheng)印(yin)物上。隨著壓力(li)的卸除，膠(jiao)粘(zhan)(zhan)(zhan)劑(ji)迅(xun)速冷卻固(gu)化(hua)(hua)，鋁(lv)層牢固(gu)地(di)附著在承(cheng)印(yin)物上，完成一個燙印(yin)過程。