燙金基(ji)本工藝(yi)是(shi)在壓力(li)狀態，即電(dian)(dian)化(hua)鋁(lv)(lv)被燙印(yin)版、承(cheng)印(yin)物(wu)(wu)壓住的狀態下，電(dian)(dian)化(hua)鋁(lv)(lv)受(shou)熱使(shi)其上(shang)熱熔性的有(you)機硅(gui)樹脂(zhi)層(ceng)(ceng)和(he)膠(jiao)(jiao)牯劑(ji)熔化(hua)，此時受(shou)熱熔化(hua)的有(you)機硅(gui)樹脂(zhi)粘性變小，而(er)特種(zhong)熱敏膠(jiao)(jiao)粘劑(ji)受(shou)熱熔化(hua)后粘性增(zeng)加，使(shi)得鋁(lv)(lv)層(ceng)(ceng)與電(dian)(dian)化(hua)鋁(lv)(lv)基(ji)膜剝(bo)離的同時轉印(yin)到(dao)了(le)承(cheng)印(yin)物(wu)(wu)上(shang)。隨著(zhu)壓力(li)的卸除，膠(jiao)(jiao)粘劑(ji)迅速(su)冷卻固化(hua)，鋁(lv)(lv)層(ceng)(ceng)牢固地(di)附著(zhu)在承(cheng)印(yin)物(wu)(wu)上(shang)，完成一(yi)個燙印(yin)過程。