燙(tang)金(jin)基(ji)本(ben)工(gong)藝(yi)是在壓力狀態，即電(dian)化(hua)(hua)(hua)鋁(lv)(lv)被燙(tang)印(yin)版、承印(yin)物(wu)壓住(zhu)的狀態下，電(dian)化(hua)(hua)(hua)鋁(lv)(lv)受熱(re)(re)使其上熱(re)(re)熔(rong)性(xing)的有機(ji)硅樹脂(zhi)層和膠牯劑(ji)熔(rong)化(hua)(hua)(hua)，此時受熱(re)(re)熔(rong)化(hua)(hua)(hua)的有機(ji)硅樹脂(zhi)粘(zhan)性(xing)變小，而特種熱(re)(re)敏膠粘(zhan)劑(ji)受熱(re)(re)熔(rong)化(hua)(hua)(hua)后粘(zhan)性(xing)增加，使得鋁(lv)(lv)層與電(dian)化(hua)(hua)(hua)鋁(lv)(lv)基(ji)膜剝離的同時轉印(yin)到了承印(yin)物(wu)上。隨著壓力的卸(xie)除(chu)，膠粘(zhan)劑(ji)迅速冷卻固化(hua)(hua)(hua)，鋁(lv)(lv)層牢(lao)固地附著在承印(yin)物(wu)上，完成一個燙(tang)印(yin)過程。