燙金基本工藝是在(zai)壓(ya)(ya)力狀態，即電(dian)化(hua)(hua)鋁(lv)被燙印(yin)版(ban)、承印(yin)物壓(ya)(ya)住的(de)狀態下，電(dian)化(hua)(hua)鋁(lv)受(shou)熱(re)(re)使其上熱(re)(re)熔(rong)性(xing)的(de)有機硅(gui)樹(shu)(shu)脂(zhi)層(ceng)和(he)膠(jiao)牯劑(ji)熔(rong)化(hua)(hua)，此(ci)時受(shou)熱(re)(re)熔(rong)化(hua)(hua)的(de)有機硅(gui)樹(shu)(shu)脂(zhi)粘(zhan)(zhan)性(xing)變小，而特種熱(re)(re)敏(min)膠(jiao)粘(zhan)(zhan)劑(ji)受(shou)熱(re)(re)熔(rong)化(hua)(hua)后粘(zhan)(zhan)性(xing)增加，使得鋁(lv)層(ceng)與電(dian)化(hua)(hua)鋁(lv)基膜剝離(li)的(de)同時轉印(yin)到了承印(yin)物上。隨著(zhu)壓(ya)(ya)力的(de)卸除，膠(jiao)粘(zhan)(zhan)劑(ji)迅速冷卻固化(hua)(hua)，鋁(lv)層(ceng)牢固地附著(zhu)在(zai)承印(yin)物上，完成(cheng)一個燙印(yin)過程。