燙金基(ji)本工藝是在(zai)壓(ya)力(li)(li)狀態，即電(dian)(dian)化(hua)(hua)鋁被燙印(yin)(yin)(yin)版、承(cheng)印(yin)(yin)(yin)物(wu)壓(ya)住(zhu)的(de)狀態下，電(dian)(dian)化(hua)(hua)鋁受(shou)熱(re)(re)使其上熱(re)(re)熔(rong)性(xing)的(de)有機硅樹(shu)脂層和膠(jiao)牯劑(ji)(ji)熔(rong)化(hua)(hua)，此時(shi)受(shou)熱(re)(re)熔(rong)化(hua)(hua)的(de)有機硅樹(shu)脂粘(zhan)(zhan)性(xing)變小，而(er)特種(zhong)熱(re)(re)敏(min)膠(jiao)粘(zhan)(zhan)劑(ji)(ji)受(shou)熱(re)(re)熔(rong)化(hua)(hua)后(hou)粘(zhan)(zhan)性(xing)增加，使得(de)鋁層與電(dian)(dian)化(hua)(hua)鋁基(ji)膜剝離的(de)同(tong)時(shi)轉印(yin)(yin)(yin)到了承(cheng)印(yin)(yin)(yin)物(wu)上。隨(sui)著壓(ya)力(li)(li)的(de)卸除，膠(jiao)粘(zhan)(zhan)劑(ji)(ji)迅(xun)速(su)冷卻固化(hua)(hua)，鋁層牢固地附著在(zai)承(cheng)印(yin)(yin)(yin)物(wu)上，完成一個(ge)燙印(yin)(yin)(yin)過程(cheng)。