燙金基本工藝是在壓(ya)力狀態(tai)，即電(dian)化(hua)(hua)鋁(lv)被(bei)燙印(yin)版、承印(yin)物(wu)(wu)壓(ya)住的(de)(de)(de)狀態(tai)下(xia)，電(dian)化(hua)(hua)鋁(lv)受(shou)(shou)熱使(shi)其上熱熔(rong)(rong)(rong)性(xing)(xing)的(de)(de)(de)有(you)(you)機(ji)硅(gui)(gui)樹脂層(ceng)和膠(jiao)牯劑(ji)熔(rong)(rong)(rong)化(hua)(hua)，此(ci)時受(shou)(shou)熱熔(rong)(rong)(rong)化(hua)(hua)的(de)(de)(de)有(you)(you)機(ji)硅(gui)(gui)樹脂粘性(xing)(xing)變小，而特種熱敏(min)膠(jiao)粘劑(ji)受(shou)(shou)熱熔(rong)(rong)(rong)化(hua)(hua)后粘性(xing)(xing)增加(jia)，使(shi)得鋁(lv)層(ceng)與電(dian)化(hua)(hua)鋁(lv)基膜剝離的(de)(de)(de)同時轉(zhuan)印(yin)到了(le)承印(yin)物(wu)(wu)上。隨著壓(ya)力的(de)(de)(de)卸除，膠(jiao)粘劑(ji)迅(xun)速冷卻固化(hua)(hua)，鋁(lv)層(ceng)牢固地附(fu)著在承印(yin)物(wu)(wu)上，完成一個燙印(yin)過程(cheng)。