燙(tang)(tang)金基本工藝(yi)是在壓(ya)力狀態，即電(dian)化(hua)(hua)(hua)鋁(lv)被燙(tang)(tang)印版(ban)、承印物壓(ya)住的(de)(de)狀態下，電(dian)化(hua)(hua)(hua)鋁(lv)受(shou)(shou)熱使(shi)其上(shang)熱熔(rong)性(xing)的(de)(de)有機硅樹(shu)(shu)脂(zhi)層(ceng)和膠(jiao)牯劑熔(rong)化(hua)(hua)(hua)，此(ci)時受(shou)(shou)熱熔(rong)化(hua)(hua)(hua)的(de)(de)有機硅樹(shu)(shu)脂(zhi)粘(zhan)性(xing)變(bian)小，而特種(zhong)熱敏膠(jiao)粘(zhan)劑受(shou)(shou)熱熔(rong)化(hua)(hua)(hua)后粘(zhan)性(xing)增加，使(shi)得(de)鋁(lv)層(ceng)與電(dian)化(hua)(hua)(hua)鋁(lv)基膜剝離的(de)(de)同(tong)時轉印到(dao)了(le)承印物上(shang)。隨(sui)著壓(ya)力的(de)(de)卸除，膠(jiao)粘(zhan)劑迅速冷卻固(gu)化(hua)(hua)(hua)，鋁(lv)層(ceng)牢固(gu)地(di)附著在承印物上(shang)，完成一個燙(tang)(tang)印過程。