燙(tang)金基本工藝是(shi)在壓力(li)狀態(tai)，即電(dian)化(hua)(hua)鋁被燙(tang)印版、承(cheng)(cheng)印物壓住的(de)(de)狀態(tai)下，電(dian)化(hua)(hua)鋁受熱使(shi)其(qi)上(shang)熱熔(rong)(rong)性(xing)的(de)(de)有機硅(gui)樹脂層和膠(jiao)牯劑(ji)熔(rong)(rong)化(hua)(hua)，此(ci)時受熱熔(rong)(rong)化(hua)(hua)的(de)(de)有機硅(gui)樹脂粘性(xing)變小，而特種熱敏(min)膠(jiao)粘劑(ji)受熱熔(rong)(rong)化(hua)(hua)后(hou)粘性(xing)增加，使(shi)得(de)鋁層與(yu)電(dian)化(hua)(hua)鋁基膜剝離的(de)(de)同(tong)時轉(zhuan)印到(dao)了承(cheng)(cheng)印物上(shang)。隨著壓力(li)的(de)(de)卸(xie)除，膠(jiao)粘劑(ji)迅速冷卻固化(hua)(hua)，鋁層牢固地(di)附著在承(cheng)(cheng)印物上(shang)，完成一個燙(tang)印過程。