燙金基(ji)本工藝是在壓(ya)力狀(zhuang)態，即(ji)電(dian)(dian)化(hua)(hua)(hua)鋁被燙印(yin)(yin)(yin)版、承印(yin)(yin)(yin)物(wu)壓(ya)住的狀(zhuang)態下，電(dian)(dian)化(hua)(hua)(hua)鋁受熱(re)使(shi)其上(shang)(shang)熱(re)熔性(xing)的有(you)機硅樹脂層(ceng)和(he)膠(jiao)牯劑(ji)熔化(hua)(hua)(hua)，此時受熱(re)熔化(hua)(hua)(hua)的有(you)機硅樹脂粘(zhan)(zhan)性(xing)變小(xiao)，而特種熱(re)敏膠(jiao)粘(zhan)(zhan)劑(ji)受熱(re)熔化(hua)(hua)(hua)后粘(zhan)(zhan)性(xing)增(zeng)加，使(shi)得鋁層(ceng)與電(dian)(dian)化(hua)(hua)(hua)鋁基(ji)膜剝離的同時轉印(yin)(yin)(yin)到(dao)了(le)承印(yin)(yin)(yin)物(wu)上(shang)(shang)。隨著(zhu)壓(ya)力的卸(xie)除(chu)，膠(jiao)粘(zhan)(zhan)劑(ji)迅速冷卻固化(hua)(hua)(hua)，鋁層(ceng)牢固地附著(zhu)在承印(yin)(yin)(yin)物(wu)上(shang)(shang)，完成一(yi)個燙印(yin)(yin)(yin)過程。