燙(tang)金基(ji)本工藝是在壓(ya)力(li)狀態，即(ji)電(dian)化(hua)鋁被燙(tang)印(yin)(yin)版、承(cheng)印(yin)(yin)物壓(ya)住的(de)狀態下，電(dian)化(hua)鋁受熱(re)使其上熱(re)熔(rong)(rong)性(xing)的(de)有(you)機硅樹(shu)脂層和膠(jiao)牯(gu)劑(ji)熔(rong)(rong)化(hua)，此時(shi)受熱(re)熔(rong)(rong)化(hua)的(de)有(you)機硅樹(shu)脂粘(zhan)(zhan)(zhan)性(xing)變小，而(er)特種(zhong)熱(re)敏膠(jiao)粘(zhan)(zhan)(zhan)劑(ji)受熱(re)熔(rong)(rong)化(hua)后粘(zhan)(zhan)(zhan)性(xing)增加，使得(de)鋁層與電(dian)化(hua)鋁基(ji)膜剝離的(de)同時(shi)轉印(yin)(yin)到了承(cheng)印(yin)(yin)物上。隨著壓(ya)力(li)的(de)卸除，膠(jiao)粘(zhan)(zhan)(zhan)劑(ji)迅速冷卻固化(hua)，鋁層牢固地附著在承(cheng)印(yin)(yin)物上，完(wan)成一個(ge)燙(tang)印(yin)(yin)過程。