燙金基(ji)本工(gong)藝(yi)是(shi)在壓(ya)力狀(zhuang)態(tai)，即(ji)電(dian)化(hua)(hua)(hua)鋁(lv)(lv)被(bei)燙印(yin)版、承(cheng)印(yin)物(wu)壓(ya)住的狀(zhuang)態(tai)下，電(dian)化(hua)(hua)(hua)鋁(lv)(lv)受熱(re)使其(qi)上(shang)熱(re)熔(rong)性(xing)的有機硅樹脂層(ceng)和膠(jiao)牯劑(ji)熔(rong)化(hua)(hua)(hua)，此時(shi)受熱(re)熔(rong)化(hua)(hua)(hua)的有機硅樹脂粘(zhan)(zhan)性(xing)變(bian)小，而(er)特種熱(re)敏膠(jiao)粘(zhan)(zhan)劑(ji)受熱(re)熔(rong)化(hua)(hua)(hua)后粘(zhan)(zhan)性(xing)增加，使得鋁(lv)(lv)層(ceng)與電(dian)化(hua)(hua)(hua)鋁(lv)(lv)基(ji)膜剝離(li)的同時(shi)轉印(yin)到了承(cheng)印(yin)物(wu)上(shang)。隨(sui)著壓(ya)力的卸除，膠(jiao)粘(zhan)(zhan)劑(ji)迅速(su)冷(leng)卻固化(hua)(hua)(hua)，鋁(lv)(lv)層(ceng)牢固地附著在承(cheng)印(yin)物(wu)上(shang)，完成(cheng)一個燙印(yin)過程。