燙(tang)金基(ji)本工藝是在(zai)壓(ya)力(li)狀(zhuang)態，即電(dian)(dian)化(hua)鋁被(bei)燙(tang)印(yin)版、承印(yin)物壓(ya)住(zhu)的狀(zhuang)態下，電(dian)(dian)化(hua)鋁受(shou)熱(re)使其上熱(re)熔(rong)性(xing)(xing)的有(you)機(ji)硅樹脂層和(he)膠(jiao)牯(gu)劑熔(rong)化(hua)，此時受(shou)熱(re)熔(rong)化(hua)的有(you)機(ji)硅樹脂粘(zhan)(zhan)性(xing)(xing)變小，而特種(zhong)熱(re)敏膠(jiao)粘(zhan)(zhan)劑受(shou)熱(re)熔(rong)化(hua)后粘(zhan)(zhan)性(xing)(xing)增加，使得鋁層與(yu)電(dian)(dian)化(hua)鋁基(ji)膜剝(bo)離的同時轉印(yin)到了承印(yin)物上。隨著(zhu)(zhu)壓(ya)力(li)的卸除(chu)，膠(jiao)粘(zhan)(zhan)劑迅速(su)冷卻固化(hua)，鋁層牢固地附著(zhu)(zhu)在(zai)承印(yin)物上，完成(cheng)一個燙(tang)印(yin)過程(cheng)。