燙(tang)金基本工藝是在壓(ya)(ya)力(li)狀(zhuang)態，即(ji)電化(hua)鋁(lv)被燙(tang)印版、承印物壓(ya)(ya)住的狀(zhuang)態下，電化(hua)鋁(lv)受熱使(shi)其上(shang)(shang)熱熔(rong)(rong)性(xing)的有機硅樹(shu)脂層(ceng)和(he)膠牯劑(ji)(ji)熔(rong)(rong)化(hua)，此時(shi)受熱熔(rong)(rong)化(hua)的有機硅樹(shu)脂粘(zhan)性(xing)變小，而特種熱敏(min)膠粘(zhan)劑(ji)(ji)受熱熔(rong)(rong)化(hua)后粘(zhan)性(xing)增(zeng)加，使(shi)得鋁(lv)層(ceng)與電化(hua)鋁(lv)基膜(mo)剝(bo)離的同時(shi)轉印到(dao)了承印物上(shang)(shang)。隨著壓(ya)(ya)力(li)的卸除，膠粘(zhan)劑(ji)(ji)迅(xun)速冷卻(que)固(gu)化(hua)，鋁(lv)層(ceng)牢固(gu)地附(fu)著在承印物上(shang)(shang)，完(wan)成一個燙(tang)印過程(cheng)。