燙(tang)(tang)金基本工藝是在壓力(li)狀(zhuang)(zhuang)態(tai)，即電化(hua)鋁(lv)被燙(tang)(tang)印(yin)版、承印(yin)物(wu)壓住的狀(zhuang)(zhuang)態(tai)下，電化(hua)鋁(lv)受(shou)熱(re)使(shi)(shi)其(qi)上(shang)熱(re)熔(rong)(rong)(rong)性(xing)的有(you)機硅樹脂層(ceng)和膠牯劑熔(rong)(rong)(rong)化(hua)，此時(shi)受(shou)熱(re)熔(rong)(rong)(rong)化(hua)的有(you)機硅樹脂粘(zhan)(zhan)性(xing)變(bian)小，而特(te)種熱(re)敏膠粘(zhan)(zhan)劑受(shou)熱(re)熔(rong)(rong)(rong)化(hua)后(hou)粘(zhan)(zhan)性(xing)增加，使(shi)(shi)得鋁(lv)層(ceng)與電化(hua)鋁(lv)基膜(mo)剝離的同時(shi)轉(zhuan)印(yin)到了承印(yin)物(wu)上(shang)。隨著(zhu)壓力(li)的卸除，膠粘(zhan)(zhan)劑迅速冷(leng)卻固化(hua)，鋁(lv)層(ceng)牢固地附(fu)著(zhu)在承印(yin)物(wu)上(shang)，完(wan)成一個燙(tang)(tang)印(yin)過程。