燙金基(ji)本工(gong)藝是在(zai)壓力狀(zhuang)(zhuang)態，即電(dian)化(hua)鋁(lv)被燙印(yin)(yin)版、承(cheng)印(yin)(yin)物(wu)(wu)壓住(zhu)的狀(zhuang)(zhuang)態下，電(dian)化(hua)鋁(lv)受(shou)(shou)(shou)熱(re)使其上(shang)(shang)熱(re)熔(rong)性(xing)的有(you)機硅(gui)樹(shu)脂層(ceng)(ceng)和膠牯劑熔(rong)化(hua)，此時受(shou)(shou)(shou)熱(re)熔(rong)化(hua)的有(you)機硅(gui)樹(shu)脂粘(zhan)性(xing)變小，而特種熱(re)敏膠粘(zhan)劑受(shou)(shou)(shou)熱(re)熔(rong)化(hua)后粘(zhan)性(xing)增加，使得鋁(lv)層(ceng)(ceng)與電(dian)化(hua)鋁(lv)基(ji)膜剝離的同(tong)時轉(zhuan)印(yin)(yin)到了承(cheng)印(yin)(yin)物(wu)(wu)上(shang)(shang)。隨著壓力的卸除(chu)，膠粘(zhan)劑迅速冷卻固(gu)(gu)化(hua)，鋁(lv)層(ceng)(ceng)牢(lao)固(gu)(gu)地附著在(zai)承(cheng)印(yin)(yin)物(wu)(wu)上(shang)(shang)，完成一(yi)個燙印(yin)(yin)過程。