燙金(jin)基(ji)本工藝是(shi)在壓力狀態，即電化(hua)(hua)鋁(lv)(lv)(lv)被燙印(yin)版、承(cheng)(cheng)印(yin)物(wu)壓住的(de)狀態下，電化(hua)(hua)鋁(lv)(lv)(lv)受(shou)熱使其上(shang)熱熔(rong)性(xing)的(de)有(you)機硅樹脂層(ceng)(ceng)和膠(jiao)牯劑(ji)(ji)熔(rong)化(hua)(hua)，此時受(shou)熱熔(rong)化(hua)(hua)的(de)有(you)機硅樹脂粘(zhan)性(xing)變小，而特種熱敏膠(jiao)粘(zhan)劑(ji)(ji)受(shou)熱熔(rong)化(hua)(hua)后粘(zhan)性(xing)增加，使得鋁(lv)(lv)(lv)層(ceng)(ceng)與電化(hua)(hua)鋁(lv)(lv)(lv)基(ji)膜剝(bo)離的(de)同(tong)時轉印(yin)到了承(cheng)(cheng)印(yin)物(wu)上(shang)。隨著(zhu)壓力的(de)卸除，膠(jiao)粘(zhan)劑(ji)(ji)迅速冷(leng)卻固(gu)化(hua)(hua)，鋁(lv)(lv)(lv)層(ceng)(ceng)牢固(gu)地附著(zhu)在承(cheng)(cheng)印(yin)物(wu)上(shang)，完成一個(ge)燙印(yin)過程。