燙(tang)金基本(ben)工藝是(shi)在(zai)壓(ya)力狀態(tai)，即(ji)電(dian)(dian)(dian)化(hua)(hua)鋁(lv)(lv)被燙(tang)印(yin)版(ban)、承(cheng)印(yin)物(wu)(wu)壓(ya)住(zhu)的狀態(tai)下，電(dian)(dian)(dian)化(hua)(hua)鋁(lv)(lv)受(shou)(shou)熱(re)使其上(shang)熱(re)熔(rong)性(xing)的有(you)機硅樹脂層(ceng)和膠牯劑熔(rong)化(hua)(hua)，此時受(shou)(shou)熱(re)熔(rong)化(hua)(hua)的有(you)機硅樹脂粘性(xing)變小，而特種熱(re)敏膠粘劑受(shou)(shou)熱(re)熔(rong)化(hua)(hua)后粘性(xing)增加，使得鋁(lv)(lv)層(ceng)與電(dian)(dian)(dian)化(hua)(hua)鋁(lv)(lv)基膜剝離的同時轉印(yin)到了(le)承(cheng)印(yin)物(wu)(wu)上(shang)。隨著(zhu)壓(ya)力的卸(xie)除，膠粘劑迅(xun)速(su)冷卻固化(hua)(hua)，鋁(lv)(lv)層(ceng)牢固地附(fu)著(zhu)在(zai)承(cheng)印(yin)物(wu)(wu)上(shang)，完成一(yi)個燙(tang)印(yin)過(guo)程。