燙金基(ji)本工藝是在壓力狀(zhuang)態，即電(dian)化鋁(lv)被燙印(yin)版、承(cheng)印(yin)物(wu)壓住的(de)(de)(de)狀(zhuang)態下，電(dian)化鋁(lv)受(shou)(shou)熱使(shi)(shi)其(qi)上(shang)熱熔(rong)(rong)(rong)性(xing)的(de)(de)(de)有機硅(gui)樹(shu)脂層和膠牯劑(ji)熔(rong)(rong)(rong)化，此時受(shou)(shou)熱熔(rong)(rong)(rong)化的(de)(de)(de)有機硅(gui)樹(shu)脂粘(zhan)性(xing)變(bian)小，而特種熱敏膠粘(zhan)劑(ji)受(shou)(shou)熱熔(rong)(rong)(rong)化后粘(zhan)性(xing)增加，使(shi)(shi)得(de)鋁(lv)層與電(dian)化鋁(lv)基(ji)膜(mo)剝離的(de)(de)(de)同時轉印(yin)到了承(cheng)印(yin)物(wu)上(shang)。隨著(zhu)壓力的(de)(de)(de)卸除(chu)，膠粘(zhan)劑(ji)迅速冷卻固化，鋁(lv)層牢固地附著(zhu)在承(cheng)印(yin)物(wu)上(shang)，完成一個燙印(yin)過程。