燙(tang)金基本工藝是在(zai)(zai)壓(ya)力(li)狀態(tai)，即電(dian)化(hua)(hua)鋁(lv)(lv)被燙(tang)印(yin)版、承(cheng)印(yin)物壓(ya)住的(de)狀態(tai)下，電(dian)化(hua)(hua)鋁(lv)(lv)受(shou)熱(re)使其(qi)上(shang)(shang)熱(re)熔(rong)性(xing)(xing)(xing)的(de)有機硅(gui)(gui)樹脂層(ceng)和膠(jiao)牯劑熔(rong)化(hua)(hua)，此時受(shou)熱(re)熔(rong)化(hua)(hua)的(de)有機硅(gui)(gui)樹脂粘(zhan)(zhan)性(xing)(xing)(xing)變小(xiao)，而(er)特種熱(re)敏(min)膠(jiao)粘(zhan)(zhan)劑受(shou)熱(re)熔(rong)化(hua)(hua)后(hou)粘(zhan)(zhan)性(xing)(xing)(xing)增(zeng)加，使得鋁(lv)(lv)層(ceng)與電(dian)化(hua)(hua)鋁(lv)(lv)基膜(mo)剝離的(de)同時轉印(yin)到了承(cheng)印(yin)物上(shang)(shang)。隨著壓(ya)力(li)的(de)卸除，膠(jiao)粘(zhan)(zhan)劑迅速(su)冷(leng)卻固化(hua)(hua)，鋁(lv)(lv)層(ceng)牢(lao)固地附著在(zai)(zai)承(cheng)印(yin)物上(shang)(shang)，完成一(yi)個燙(tang)印(yin)過程。