燙金基(ji)本工藝(yi)是(shi)在壓力狀態，即電化(hua)(hua)鋁(lv)(lv)被燙印(yin)(yin)(yin)(yin)版(ban)、承印(yin)(yin)(yin)(yin)物(wu)壓住的狀態下(xia)，電化(hua)(hua)鋁(lv)(lv)受熱(re)使其上熱(re)熔(rong)(rong)性(xing)的有機硅樹脂層和膠(jiao)牯劑熔(rong)(rong)化(hua)(hua)，此時受熱(re)熔(rong)(rong)化(hua)(hua)的有機硅樹脂粘(zhan)(zhan)性(xing)變小，而特(te)種熱(re)敏膠(jiao)粘(zhan)(zhan)劑受熱(re)熔(rong)(rong)化(hua)(hua)后粘(zhan)(zhan)性(xing)增加，使得鋁(lv)(lv)層與電化(hua)(hua)鋁(lv)(lv)基(ji)膜剝離的同(tong)時轉(zhuan)印(yin)(yin)(yin)(yin)到了承印(yin)(yin)(yin)(yin)物(wu)上。隨著壓力的卸(xie)除，膠(jiao)粘(zhan)(zhan)劑迅速冷卻固化(hua)(hua)，鋁(lv)(lv)層牢固地附著在承印(yin)(yin)(yin)(yin)物(wu)上，完成一個燙印(yin)(yin)(yin)(yin)過程。