燙(tang)金(jin)基本工藝是(shi)在壓力狀(zhuang)態，即電(dian)化(hua)(hua)鋁(lv)被燙(tang)印版(ban)、承(cheng)印物(wu)壓住的(de)(de)狀(zhuang)態下，電(dian)化(hua)(hua)鋁(lv)受熱使其上(shang)熱熔(rong)(rong)性(xing)的(de)(de)有(you)機硅(gui)樹脂層和膠(jiao)牯(gu)劑(ji)熔(rong)(rong)化(hua)(hua)，此(ci)時(shi)受熱熔(rong)(rong)化(hua)(hua)的(de)(de)有(you)機硅(gui)樹脂粘(zhan)性(xing)變小，而特種熱敏膠(jiao)粘(zhan)劑(ji)受熱熔(rong)(rong)化(hua)(hua)后粘(zhan)性(xing)增加，使得鋁(lv)層與電(dian)化(hua)(hua)鋁(lv)基膜剝離的(de)(de)同(tong)時(shi)轉印到(dao)了承(cheng)印物(wu)上(shang)。隨(sui)著壓力的(de)(de)卸除(chu)，膠(jiao)粘(zhan)劑(ji)迅(xun)速冷卻(que)固化(hua)(hua)，鋁(lv)層牢固地(di)附著在承(cheng)印物(wu)上(shang)，完成一個(ge)燙(tang)印過程。