燙金基本工藝是(shi)在壓力狀態，即(ji)電(dian)化(hua)(hua)(hua)鋁(lv)被燙印(yin)(yin)版、承印(yin)(yin)物(wu)壓住的狀態下，電(dian)化(hua)(hua)(hua)鋁(lv)受熱(re)(re)使(shi)其上(shang)熱(re)(re)熔(rong)性(xing)的有機硅樹脂(zhi)層(ceng)和膠牯(gu)劑(ji)熔(rong)化(hua)(hua)(hua)，此(ci)時(shi)受熱(re)(re)熔(rong)化(hua)(hua)(hua)的有機硅樹脂(zhi)粘(zhan)性(xing)變小，而特(te)種熱(re)(re)敏膠粘(zhan)劑(ji)受熱(re)(re)熔(rong)化(hua)(hua)(hua)后(hou)粘(zhan)性(xing)增加，使(shi)得鋁(lv)層(ceng)與電(dian)化(hua)(hua)(hua)鋁(lv)基膜剝離的同時(shi)轉印(yin)(yin)到(dao)了承印(yin)(yin)物(wu)上(shang)。隨著壓力的卸(xie)除，膠粘(zhan)劑(ji)迅(xun)速冷卻固(gu)(gu)化(hua)(hua)(hua)，鋁(lv)層(ceng)牢固(gu)(gu)地附(fu)著在承印(yin)(yin)物(wu)上(shang)，完(wan)成一個燙印(yin)(yin)過程。