燙金基(ji)本工藝(yi)是在壓(ya)(ya)力狀態(tai)，即電(dian)化(hua)(hua)鋁被燙印版、承(cheng)(cheng)印物(wu)壓(ya)(ya)住的(de)(de)狀態(tai)下，電(dian)化(hua)(hua)鋁受(shou)熱(re)使其上熱(re)熔(rong)(rong)性的(de)(de)有機硅(gui)樹脂層(ceng)和膠牯劑(ji)(ji)熔(rong)(rong)化(hua)(hua)，此時受(shou)熱(re)熔(rong)(rong)化(hua)(hua)的(de)(de)有機硅(gui)樹脂粘性變小(xiao)，而特種熱(re)敏膠粘劑(ji)(ji)受(shou)熱(re)熔(rong)(rong)化(hua)(hua)后(hou)粘性增加，使得鋁層(ceng)與(yu)電(dian)化(hua)(hua)鋁基(ji)膜(mo)剝離(li)的(de)(de)同時轉印到了承(cheng)(cheng)印物(wu)上。隨著壓(ya)(ya)力的(de)(de)卸除，膠粘劑(ji)(ji)迅速冷卻固(gu)化(hua)(hua)，鋁層(ceng)牢固(gu)地附著在承(cheng)(cheng)印物(wu)上，完成一個燙印過程。