燙(tang)(tang)金基(ji)本工藝(yi)是在壓力狀態(tai)(tai)，即(ji)電(dian)化(hua)(hua)(hua)鋁(lv)被燙(tang)(tang)印(yin)版(ban)、承印(yin)物(wu)壓住的(de)狀態(tai)(tai)下，電(dian)化(hua)(hua)(hua)鋁(lv)受(shou)熱使其(qi)上熱熔(rong)(rong)性(xing)的(de)有(you)機(ji)硅樹(shu)脂(zhi)層和膠牯(gu)劑(ji)熔(rong)(rong)化(hua)(hua)(hua)，此時受(shou)熱熔(rong)(rong)化(hua)(hua)(hua)的(de)有(you)機(ji)硅樹(shu)脂(zhi)粘性(xing)變(bian)小，而特種熱敏膠粘劑(ji)受(shou)熱熔(rong)(rong)化(hua)(hua)(hua)后粘性(xing)增加(jia)，使得鋁(lv)層與電(dian)化(hua)(hua)(hua)鋁(lv)基(ji)膜剝(bo)離(li)的(de)同時轉印(yin)到(dao)了承印(yin)物(wu)上。隨著壓力的(de)卸除，膠粘劑(ji)迅速冷(leng)卻固(gu)化(hua)(hua)(hua)，鋁(lv)層牢固(gu)地附著在承印(yin)物(wu)上，完成一個燙(tang)(tang)印(yin)過程。