燙金基本工藝是(shi)在(zai)壓力狀態，即電(dian)化(hua)(hua)鋁(lv)(lv)被燙印(yin)(yin)版、承(cheng)印(yin)(yin)物(wu)壓住(zhu)的狀態下(xia)，電(dian)化(hua)(hua)鋁(lv)(lv)受(shou)熱(re)(re)使其上(shang)熱(re)(re)熔(rong)性(xing)的有機硅(gui)樹脂(zhi)層(ceng)和膠牯劑(ji)熔(rong)化(hua)(hua)，此時受(shou)熱(re)(re)熔(rong)化(hua)(hua)的有機硅(gui)樹脂(zhi)粘(zhan)性(xing)變小，而(er)特(te)種(zhong)熱(re)(re)敏膠粘(zhan)劑(ji)受(shou)熱(re)(re)熔(rong)化(hua)(hua)后粘(zhan)性(xing)增加，使得鋁(lv)(lv)層(ceng)與電(dian)化(hua)(hua)鋁(lv)(lv)基膜剝離的同時轉印(yin)(yin)到了承(cheng)印(yin)(yin)物(wu)上(shang)。隨著(zhu)壓力的卸除，膠粘(zhan)劑(ji)迅速冷卻固化(hua)(hua)，鋁(lv)(lv)層(ceng)牢固地附著(zhu)在(zai)承(cheng)印(yin)(yin)物(wu)上(shang)，完成一個燙印(yin)(yin)過(guo)程(cheng)。