燙金(jin)基(ji)本工藝是在壓(ya)力(li)狀態(tai)，即(ji)電(dian)(dian)化鋁(lv)被燙印版、承印物(wu)壓(ya)住(zhu)的狀態(tai)下，電(dian)(dian)化鋁(lv)受(shou)熱(re)使其上(shang)熱(re)熔(rong)性(xing)的有(you)機硅(gui)樹(shu)脂層(ceng)和(he)膠(jiao)(jiao)牯劑熔(rong)化，此時(shi)受(shou)熱(re)熔(rong)化的有(you)機硅(gui)樹(shu)脂粘(zhan)(zhan)性(xing)變(bian)小，而(er)特種熱(re)敏膠(jiao)(jiao)粘(zhan)(zhan)劑受(shou)熱(re)熔(rong)化后粘(zhan)(zhan)性(xing)增加(jia)，使得鋁(lv)層(ceng)與(yu)電(dian)(dian)化鋁(lv)基(ji)膜(mo)剝離的同時(shi)轉印到了承印物(wu)上(shang)。隨著(zhu)壓(ya)力(li)的卸(xie)除，膠(jiao)(jiao)粘(zhan)(zhan)劑迅速(su)冷卻固化，鋁(lv)層(ceng)牢固地附著(zhu)在承印物(wu)上(shang)，完成一(yi)個燙印過程。