燙金(jin)基(ji)本工藝(yi)是(shi)在壓力狀態(tai)，即(ji)電(dian)化(hua)(hua)鋁(lv)被燙印(yin)版、承印(yin)物壓住(zhu)的(de)(de)(de)狀態(tai)下(xia)，電(dian)化(hua)(hua)鋁(lv)受熱(re)使(shi)其上(shang)熱(re)熔(rong)性(xing)(xing)(xing)的(de)(de)(de)有機硅(gui)樹脂層和膠(jiao)(jiao)牯(gu)劑(ji)熔(rong)化(hua)(hua)，此時(shi)受熱(re)熔(rong)化(hua)(hua)的(de)(de)(de)有機硅(gui)樹脂粘(zhan)(zhan)性(xing)(xing)(xing)變(bian)小，而特種(zhong)熱(re)敏膠(jiao)(jiao)粘(zhan)(zhan)劑(ji)受熱(re)熔(rong)化(hua)(hua)后粘(zhan)(zhan)性(xing)(xing)(xing)增(zeng)加，使(shi)得鋁(lv)層與(yu)電(dian)化(hua)(hua)鋁(lv)基(ji)膜剝離的(de)(de)(de)同時(shi)轉印(yin)到了承印(yin)物上(shang)。隨著壓力的(de)(de)(de)卸除，膠(jiao)(jiao)粘(zhan)(zhan)劑(ji)迅速冷(leng)卻固化(hua)(hua)，鋁(lv)層牢固地附著在承印(yin)物上(shang)，完成一個燙印(yin)過程。