燙金基(ji)(ji)本工藝(yi)是在壓(ya)力狀(zhuang)態，即電(dian)化(hua)鋁(lv)被燙印版(ban)、承(cheng)(cheng)印物(wu)壓(ya)住的(de)(de)(de)狀(zhuang)態下(xia)，電(dian)化(hua)鋁(lv)受熱(re)使其上熱(re)熔(rong)性(xing)的(de)(de)(de)有機(ji)(ji)硅樹(shu)脂(zhi)層(ceng)(ceng)和膠(jiao)(jiao)牯劑熔(rong)化(hua)，此時(shi)受熱(re)熔(rong)化(hua)的(de)(de)(de)有機(ji)(ji)硅樹(shu)脂(zhi)粘性(xing)變(bian)小，而特種熱(re)敏膠(jiao)(jiao)粘劑受熱(re)熔(rong)化(hua)后粘性(xing)增加，使得鋁(lv)層(ceng)(ceng)與電(dian)化(hua)鋁(lv)基(ji)(ji)膜剝(bo)離的(de)(de)(de)同時(shi)轉印到了承(cheng)(cheng)印物(wu)上。隨著壓(ya)力的(de)(de)(de)卸除，膠(jiao)(jiao)粘劑迅速冷(leng)卻固(gu)化(hua)，鋁(lv)層(ceng)(ceng)牢(lao)固(gu)地附著在承(cheng)(cheng)印物(wu)上，完(wan)成(cheng)一個燙印過(guo)程。