燙(tang)金基本工藝(yi)是在壓力狀態，即電(dian)(dian)化(hua)(hua)鋁(lv)被燙(tang)印(yin)(yin)版、承(cheng)印(yin)(yin)物(wu)壓住的狀態下，電(dian)(dian)化(hua)(hua)鋁(lv)受熱使(shi)其上熱熔(rong)(rong)性(xing)的有機(ji)硅(gui)樹脂層(ceng)和(he)膠牯劑熔(rong)(rong)化(hua)(hua)，此時(shi)受熱熔(rong)(rong)化(hua)(hua)的有機(ji)硅(gui)樹脂粘性(xing)變小，而特(te)種熱敏膠粘劑受熱熔(rong)(rong)化(hua)(hua)后粘性(xing)增加，使(shi)得鋁(lv)層(ceng)與電(dian)(dian)化(hua)(hua)鋁(lv)基膜剝離(li)的同時(shi)轉印(yin)(yin)到了承(cheng)印(yin)(yin)物(wu)上。隨(sui)著(zhu)壓力的卸除，膠粘劑迅速冷卻固化(hua)(hua)，鋁(lv)層(ceng)牢固地附著(zhu)在承(cheng)印(yin)(yin)物(wu)上，完(wan)成(cheng)一(yi)個燙(tang)印(yin)(yin)過(guo)程。