燙(tang)(tang)金基本工藝是(shi)在壓(ya)力狀態(tai)，即電(dian)化鋁(lv)被燙(tang)(tang)印版、承(cheng)印物(wu)(wu)壓(ya)住(zhu)的狀態(tai)下，電(dian)化鋁(lv)受(shou)(shou)熱(re)使其上熱(re)熔(rong)(rong)性(xing)(xing)的有機硅(gui)樹脂層(ceng)(ceng)(ceng)和膠(jiao)牯劑(ji)熔(rong)(rong)化，此時(shi)受(shou)(shou)熱(re)熔(rong)(rong)化的有機硅(gui)樹脂粘性(xing)(xing)變小，而特種熱(re)敏膠(jiao)粘劑(ji)受(shou)(shou)熱(re)熔(rong)(rong)化后粘性(xing)(xing)增加，使得鋁(lv)層(ceng)(ceng)(ceng)與電(dian)化鋁(lv)基膜剝離(li)的同(tong)時(shi)轉印到(dao)了承(cheng)印物(wu)(wu)上。隨著壓(ya)力的卸除，膠(jiao)粘劑(ji)迅速冷卻固化，鋁(lv)層(ceng)(ceng)(ceng)牢固地(di)附著在承(cheng)印物(wu)(wu)上，完(wan)成一個燙(tang)(tang)印過程。