燙金(jin)基本(ben)工藝是在壓力狀態，即(ji)電(dian)(dian)化(hua)(hua)鋁被燙印(yin)版、承(cheng)印(yin)物(wu)(wu)壓住的(de)狀態下，電(dian)(dian)化(hua)(hua)鋁受(shou)(shou)熱(re)(re)使其上(shang)熱(re)(re)熔(rong)(rong)性(xing)的(de)有機硅樹脂層(ceng)和膠牯劑(ji)熔(rong)(rong)化(hua)(hua)，此時(shi)(shi)受(shou)(shou)熱(re)(re)熔(rong)(rong)化(hua)(hua)的(de)有機硅樹脂粘(zhan)性(xing)變小(xiao)，而特種熱(re)(re)敏(min)膠粘(zhan)劑(ji)受(shou)(shou)熱(re)(re)熔(rong)(rong)化(hua)(hua)后粘(zhan)性(xing)增加(jia)，使得鋁層(ceng)與電(dian)(dian)化(hua)(hua)鋁基膜剝離(li)的(de)同(tong)時(shi)(shi)轉印(yin)到了承(cheng)印(yin)物(wu)(wu)上(shang)。隨(sui)著壓力的(de)卸除，膠粘(zhan)劑(ji)迅(xun)速冷卻(que)固化(hua)(hua)，鋁層(ceng)牢固地附著在承(cheng)印(yin)物(wu)(wu)上(shang)，完(wan)成一個燙印(yin)過程(cheng)。